7月16日(木)13:30-16:40に、日本実装技術振興協会 #JJTTA が第239回定例講演会『チップレット時代に向けた先端実装・基板技術の最新動向と課題』を開催。川崎市幸区・川崎市産業振興会館およびオンラインにて。講演5件。講演後に技術交流会。詳細は https://www.j-jisso.org/pdf/239.pdf に。
#Seminar #Chiplet #AdvancedPackaging #PCB

TSMC's roadmap shows AI chip progress is becoming as much about packaging as process nodes. CoPoS may scale package size, but CoWoS still looks key for dense HBM links.

#tech #technology #tsmc #advancedpackaging #aichips #hbm

https://techshowup.com/News/Article/019f08df-9fae-72e8-a602-ef1e5bb60a0a/tsmcs-copos-path-highlights-why-cowos-remains-key-for-huge-a

TSMC’s CoPoS Path Highlights Why CoWoS Remains Key for Huge AI Packages

TSMC’s packaging roadmap shows that future AI chips are not just a node race. CoPoS may unlock larger packages, but CoWoS still owns the dense links AI accelerators need.

Tech ShowUp
Sachsens Chipindustrie sucht Schulterschluss mit Japan und Irland - Oiger

3 Tiger auf dem Sprung in die Mikroelektronik-Spitzenliga: Sachsen will Chip-Allianz mit Japan und Irland schmieden

Oiger
7月29日(水)13:00-17:35に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が公開研究会『先端半導体パッケージに向けた微細回路形成技術の最前線 ― めっき・露光・レジスト ―』を開催。講演5件。詳細は https://jiep.or.jp/tech-committees/pdf/20260729.pdf に。
#Seminar #AdvancedPackaging
ウェブメディア #iConnect007 が発行するニュースレター “Advanced Electronics Packaging Digest” #AEPD は、配信プラットフォームを新たに #Substack へと拡張した。メール配信に加えて、2月号からは https://iconnect007.substack.com/ で閲覧することが可能に。発表は https://iconnect007.com/article/148899/advanced-electronics-packaging-digest-expands-its-reach-with-new-substack-presence に。
#Newsletter #AdvancedPackaging

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam
2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding