Sachsens Chipindustrie sucht Schulterschluss mit Japan und Irland - Oiger

3 Tiger auf dem Sprung in die Mikroelektronik-Spitzenliga: Sachsen will Chip-Allianz mit Japan und Irland schmieden

Oiger
7月29日(水)13:00-17:35に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が公開研究会『先端半導体パッケージに向けた微細回路形成技術の最前線 ― めっき・露光・レジスト ―』を開催。講演5件。詳細は https://jiep.or.jp/tech-committees/pdf/20260729.pdf に。
#Seminar #AdvancedPackaging
ウェブメディア #iConnect007 が発行するニュースレター “Advanced Electronics Packaging Digest” #AEPD は、配信プラットフォームを新たに #Substack へと拡張した。メール配信に加えて、2月号からは https://iconnect007.substack.com/ で閲覧することが可能に。発表は https://iconnect007.com/article/148899/advanced-electronics-packaging-digest-expands-its-reach-with-new-substack-presence に。
#Newsletter #AdvancedPackaging

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam
2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding
TSMC will sich mit einer eigenen Talent-Pipeline die Fachkräfte für die neue Chipfabrik in Dresden selbst heranziehen. Hunderte Taiwanesen unterstützen den Hochlauf der 10,5-Milliarden-Euro-Fab.
https://oiger.de/2025/11/11/tsmc-chipfabrik-baut-eigene-talent-pipeline-in-dresden-auf/195684
#ESMC #Bosch #Infineon #NXP #Sachsen #Mikroelektronik #AdvancedPackaging #Foundry2.0 #Endmontage #Backend
TSMC-Chipfabrik baut eigene „Talent-Pipeline“ in Dresden auf - Oiger

TSMC will mit eigener Talent-Pipeline Fachkräfte für die Chipfabrik Dresden heranziehen. Hunderte Taiwanesen helfen beim Hochlauf der 10,5-Milliarden-Euro-Fab

Oiger
11月21日(金)13:00-17:00に、グローバルネット㈱がセミナー『先端パッケージにおけるパネルレベル基板プロセスの動向』を開催。講演4件。東京都千代田区・プラザエフおよびオンライン(Zoom)にて。詳細は https://global-net.co.jp/archives/11877 に。
#Seminar #AdvancedPackaging #PanelLevel