Yonhap Infomax NewsApr 22
Tokyo Electron Korea launches Prexa SDP prober for advanced packaging chip testing, targeting AI semiconductor market with active thermal control technology as demand for Known Good Device selection grows amid 2.5D/3D packaging expansion and HBM applications requiring enhanced yield management capabilities.
#YonhapInfomax #TokyoElectron #PrexaSDP #AdvancedPackaging #AISemiconductors #ChipTesting #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=116897
Tokyo Electron Launches 'Prexa SDP' Individual Chip Inspection Equipment for Advanced Packaging

Tokyo Electron Korea launches Prexa SDP prober for advanced packaging chip testing, targeting AI semiconductor market with active thermal control technology as demand for Known Good Device selection grows amid 2.5D/3D packaging expansion and HBM applications requiring enhanced yield management capabilities.

Yonhap Infomax
Yonhap Infomax NewsApr 22
SK Hynix breaks ground on 19 trillion won AI memory back-end facility P&T7 in Cheongju, featuring advanced packaging for HBM production with sequential completion planned for 2027-2028, creating 3,000 permanent jobs as the company's fifth production base in the region to strengthen global AI semiconductor leadership.
#YonhapInfomax #SKHynix #PT7 #AIMemory #AdvancedPackaging #CheongjiTechnopolis #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=116866
SK Hynix Breaks Ground on 19 Trillion Won P&T7 at Cheongju Technopolis

SK Hynix breaks ground on 19 trillion won AI memory back-end facility P&T7 in Cheongju, featuring advanced packaging for HBM production with sequential completion planned for 2027-2028, creating 3,000 permanent jobs as the company's fifth production base in the region to strengthen global AI semiconductor leadership.

Yonhap Infomax
Jisso NewsMar 13
ウェブメディア #iConnect007 が発行するニュースレター “Advanced Electronics Packaging Digest” #AEPD は、配信プラットフォームを新たに #Substack へと拡張した。メール配信に加えて、2月号からは https://iconnect007.substack.com/ で閲覧することが可能に。発表は https://iconnect007.com/article/148899/advanced-electronics-packaging-digest-expands-its-reach-with-new-substack-presence に。
#Newsletter #AdvancedPackaging
BuySellRam.comMar 1

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam
Alex S.Mar 1

Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam
BuySellRam.comMar 1

With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

https://www.buysellram.com/blog/nvidia-next-gen-feynman-beyond-training-toward-inference-sovereignty/

#InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

NVIDIA Next-Gen Feynman: Beyond Training, Toward Inference Sovereignty

Prepare for NVIDIA GTC 2026. Explore the shift to Inference Sovereignty, the 1.6nm Feynman architecture, deterministic LPX cores, and the future of 100M IOPS AI storage.

BuySellRam
Jisso NewsJan 22
2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding
WinbuzzerJan 20

https://winbuzzer.com/2026/01/20/taiwan-unveils-open-access-chip-packaging-platform-to-challenge-tsmcs-dominance-xcxwbn/

Taiwan Unveils Open-access Chip Packaging Platform to Challenge TSMC’s Dominance

#TSMC #Semiconductors #AIChips #ChipManufacturing #Hardware #NVIDIA #AMD #Intel #Google #AI #ChipIndustry #AIHardware #AdvancedPackaging #Taiwan #CoWoS

Yonhap Infomax NewsJan 13
SK hynix will invest 19 trillion won ($14.3 billion) to build a new advanced packaging fab in Cheongju, aiming to meet soaring global AI memory demand and strengthen its production base.
#YonhapInfomax #SKHynix #Cheongju #AdvancedPackaging #HBM #AIMemoryDemand #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=99484
SK hynix to Invest 19 Trillion Won in New Advanced Packaging Fab in Cheongju

SK hynix will invest 19 trillion won ($14.3 billion) to build a new advanced packaging fab in Cheongju, aiming to meet soaring global AI memory demand and strengthen its production base.

Yonhap Infomax
Yonhap Infomax NewsJan 13
SK hynix Inc. will invest 19 trillion won ($14.3 billion) to build an advanced packaging fab in Cheongju, targeting soaring AI memory demand with completion set for late next year.
#YonhapInfomax #SKHynix #AdvancedPackaging #Cheongju #AIMemory #19TrillionWon #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=99480
SK hynix to Invest 19 Trillion Won in New Advanced Packaging Fab in Cheongju

SK hynix Inc. will invest 19 trillion won ($14.3 billion) to build an advanced packaging fab in Cheongju, targeting soaring AI memory demand with completion set for late next year.

Yonhap Infomax