European Deeptech NewsMay 5

Hybrid bonders are all the rage at fabs around the world that produce high-bandwidth memory & AI chips.

The world leader in hybrid bonding is a 🇳🇱 company called Besi.

Today, we pay tribute to Richard Fierkens who passed away on Sunday. He founded Fico Toolings, laying the groundwork for Besi.

Fico started in 1956 from a workshop in Herwen, producing molds for simple plastic products such as coat hangers and milk crates.

https://bits-chips.com/article/richard-fierkens-1935-2026-a-forgotten-dutch-chip-pioneer/

#deeptech #Semiconductors #HybridBonding

Yonhap Infomax NewsApr 6
SK Hynix is expected to launch HBM5 memory around 2029-2030, marking a turning point for hybrid bonding technology in next-generation AI GPU cycles, with strategic partnerships with Applied Materials and BESI providing competitive advantages in mass production capabilities and market leadership.
#YonhapInfomax #SKHynix #HBM5 #HybridBonding #AppliedMaterials #MassProduction #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=113956
SK Hynix Expected to Launch HBM5 as Early as 2029

SK Hynix is expected to launch HBM5 memory around 2029-2030, marking a turning point for hybrid bonding technology in next-generation AI GPU cycles, with strategic partnerships with Applied Materials and BESI providing competitive advantages in mass production capabilities and market leadership.

Yonhap Infomax
Jisso NewsJan 22
2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding
oigerJan 2
Süss Microtec plant laut Handelsblatt 45-Mio.-€-Entwicklungszentrum für Reinraum-Technik - Standort noch unklar. Mit Sachsen sind die Bayern seit DDR-Zeiten verbunden
https://oiger.de/2026/01/02/handelsblatt-chipfabrik-ausruester-suess-plant-neues-entwicklungszentrum/196052
#Süss #Bayern #Chipfabrik #Ausrüster #HybridBonding #Nanoimprint #Lithografie #Reinraum #SiliconSaxony #Halbleiter #Wachstum #Mikroelektronik
Handelsblatt: Chipfabrik-Ausrüster Süss plant neues Entwicklungszentrum - Oiger

Süss Microtec plant laut Handelsblatt 45-Mio.-€-Entwicklungszentrum für Reinraum-Technik - Standort noch unklar. Mit Sachsen ist Süss seit DDR-Zeiten verbunden

Oiger
Yonhap Infomax NewsNov 26, 2025
Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.
#YonhapInfomax #AppliedMaterials #HybridBonding #HBM #SemiconductorEquipment #ProcessEfficiency #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=92548
Applied Materials Unveils Hybrid Bonding System for Next-Generation HBM

Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.

Yonhap Infomax
Yonhap Infomax NewsMay 1, 2025
Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market
#YonhapInfomax #HanwhaSemitec #SemiconductorEquipment #TCBonder #HybridBonding #RDInvestment #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=61343
Hanwha Semitec Gears Up for Next-Generation Semiconductor Equipment Development

Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market

Yonhap Infomax