2月3日(火)13:00-17:25に、エレクトロニクス実装学会
#JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は
https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding
Handelsblatt: Chipfabrik-Ausrüster Süss plant neues Entwicklungszentrum - Oiger
Süss Microtec plant laut Handelsblatt 45-Mio.-€-Entwicklungszentrum für Reinraum-Technik - Standort noch unklar. Mit Sachsen ist Süss seit DDR-Zeiten verbunden
Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.
#YonhapInfomax #AppliedMaterials #HybridBonding #HBM #SemiconductorEquipment #ProcessEfficiency #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket https://en.infomaxai.com/news/articleView.html?idxno=92548
Applied Materials Unveils Hybrid Bonding System for Next-Generation HBM
Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.
Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market
#YonhapInfomax #HanwhaSemitec #SemiconductorEquipment #TCBonder #HybridBonding #RDInvestment #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket https://en.infomaxai.com/news/articleView.html?idxno=61343
Hanwha Semitec Gears Up for Next-Generation Semiconductor Equipment Development
Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market
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