Handelsblatt: Chipfabrik-Ausrüster Süss plant neues Entwicklungszentrum - Oiger
Süss Microtec plant laut Handelsblatt 45-Mio.-€-Entwicklungszentrum für Reinraum-Technik - Standort noch unklar. Mit Sachsen ist Süss seit DDR-Zeiten verbunden
Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.
#YonhapInfomax #AppliedMaterials #HybridBonding #HBM #SemiconductorEquipment #ProcessEfficiency #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket https://en.infomaxai.com/news/articleView.html?idxno=92548
Applied Materials Unveils Hybrid Bonding System for Next-Generation HBM
Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.
Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market
#YonhapInfomax #HanwhaSemitec #SemiconductorEquipment #TCBonder #HybridBonding #RDInvestment #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket https://en.infomaxai.com/news/articleView.html?idxno=61343
Hanwha Semitec Gears Up for Next-Generation Semiconductor Equipment Development
Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market
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