TSMC'de 2nm çip verileri çalındı! Yarı iletken sektöründe yeni bir casusluk olayı yaşanıyor. Kritik bilgiler sızdırılırken, veri güvenliği endişeleri artıyor. Bu durum, sektördeki rekabeti ve fikri mülkiyetin korunmasının önemini bir kez daha gözler önüne seriyor.

🚩 #TSMC #ÇipTeknolojisi #VeriGüvenliği #SiberGüvenlik #Teknoloji

🔌 TSMC completamente prenotata fino al 2028, inclusa la fabbrica dell'Arizona! Avanti tutta con l'innovazione tecnologica! #TSMC #TechNews

🔗 https://www.tomshw.it/hardware/tsmc-capacita-esaurita-fino-al-2028-e-oltre-2026-03-31

TSMC al completo fino al 2028, fab Arizona inclusa

La capacità produttiva di TSMC è esaurita fino al 2028, con prenotazioni che coprono anche linee non ancora costruite, tra cui il nodo N2 a 2 nanometri.

Tom's Hardware

半導体の「夢の技術」1nmプロセス競争が激化:フォークシート構造の進化とTSMCの前倒し戦略が意味する限界突破への挑戦

半導体プロセス技術の微細化は、数十年にわたり情報通信産業の根幹を支えてきたが、現在、物理学的な限界と言われる領域へと明確に突入している。ナノメートル単位の技術競争が激しさを増すなか、業界の焦点は実用化が進みつつある2nmから、次世代の「夢の半導体」と呼ばれる1nm(A10)プロセスへと確実に移行している。 韓国のSamsung […]

https://xenospectrum.com/1nm-semiconductor-fabrication-forksheet-tsmc-competition/

Angebliche Packaging-Probleme: Nvidia Rubin Ultra reizt CoWoS-L von TSMC aus

Seit Wochenbeginn wird spekuliert, ob Nvidias Rubin Ultra wirklich Ende 2027 kommen wird Es scheint Probleme beim Packaging zu geben.

ComputerBase

TSMC's 2028 Capacity Full, Samsung Foundry Emerges as Alternative

TSMC’s 2-nanometer process fully booked until 2028, creating opportunity for Samsung Electronics Foundry to capture big tech clients amid AI chip demand surge.

TSMC's 2028 Capacity Full, Samsung Foundry Emerges as Alternative

TSMCs 2028 Capacity Full, Samsung Foundry Emerges as Alternative TSMCs 2-nanometer process fully booked until 2028, creating opportunity for Samsung Electronics Foundry to capture big tech clients amid AI chip demand surge

조선일보
TSMC's 3nm chip capacity has reached critical shortage as major tech companies scramble for supplies. GPU and CPU designers alongside cloud giants like Amazon and Microsoft are fighting for orders, making the foundry the industry's biggest bottleneck. The shortage is disrupting product roadmaps across multiple companies. https://technode.com/2026/03/30/tsmc-faces-broad-3nm-capacity-shortage-fueling-supply-chain-battle/ #China #Tech #Semiconductors #TSMC
TSMC faces broad 3nm capacity shortage, fueling supply chain battle

According to DigiTimes, TSMC’s 3nm process capacity has entered an extremely rare state of “overload,” as a fierce battle for capacity sweeps across the

TechNode

🆕Czy Exynos 2800 przywróci zaufanie do autorskich układów Samsunga?
➡️https://rootblog.pl/exynos-2800-zdradza-pierwsze-szczegoly-na-swoj-temat/

#exynos #Exynos2800 #GalaxyS28 #Qualcomm #samsung #TSMC

TSMC sob pressão: Pior seca dos últimos 75 anos em Taiwan ameaça a produção de chips
🔗 https://tugatech.com.pt/t80983-tsmc-sob-pressao-pior-seca-dos-ultimos-75-anos-em-taiwan-ameaca-a-producao-de-chips

#pior #press #taiwan #tsmc 

TSMC sob pressão: Pior seca dos últimos 75 anos em Taiwan ameaça a produção de chips

A indústria global de semicondutores enfrenta um novo desafio com Taiwan a registar a pior escassez de água dos últimos 75 anos. A zona mais atingida por esta s

TugaTech

アップル初の折りたたみiPhone、9月発表・12月出荷観測。厚さ4.5ミリ級、“折り目”ほぼ解消か

https://fed.brid.gy/r/https://36kr.jp/487514/

アップル初の折りたたみiPhone、9月発表・12月出荷観測。厚さ4.5ミリ級、“折り目”ほぼ解消か | 36Kr Japan | 最大級の中国テック・スタートアップ専門メディア

米アップル製品に詳しい英バークレイズ銀行の著名アナリストTim Long氏によると、アップル初の折りたたみ式スマートフォン「iPh…

36Kr Japan | 最大級の中国テック・スタートアップ専門メディア