if you think that the precariously balanced tower of flash above is an inaccurate representation of what's going on, i can reassure you that
(a) this is exactly how it looks like, and
(b) SK Hynix is up to 24 layers already (not sure in what application)
https://news.skhynix.com/semiconductor-back-end-process-episode-4-packages-part-2/


(The following is an update of a post that originally ran on 1 November 2013. It was republished in 2024 as a part of a series to honor the 3D NAND inventors who have received the 2024 FMS Lifetime Achievement Award.) Let’s look at how one form of 3D NAND is manufactured. For this post
@whitequark the 24 layer one will truly blow your mind, and then some.
Notice how certain GPUs have weird memory configurations, which are divisible by 12/24/48/96 but not 8/16/32/64?
Those are HBM3/HBM3E. SK Hynix constructs their 24GB and 48GB HBM3E modules by stacking 1GB and 2GB modules 24 high with TSVs.
@whitequark but wait! It gets even fucking *crazier*. Besides the fact that TSV means one bad joint scraps the whole part.
Everyone's heard of the big 3 and ASML.
Nobody's heard of Hanmi, Besi, or Applied Materials. Who are all WAY more important than ASML.
Those are the companies that make the machines that saw wafers, place those layers, and *bond* those layers. Yeah. They're the people responsible for the Jenga.
So is that how the terabyte-plus microSD cards do it? I have noticed they seem more prone to heat failure than smaller capacity cards