Given a through-hole capacitor to ground on a multi-layer PCB, can you find which ground planes provide the return path?

Context is a six layer kit PCB with a kinda GGGGGG stack-up. Through-hole grounds connect to every layer. The default thermal relief might be ok for SGGS but on this board it’s an ordeal to de-solder any ground lead.

Could the designer connect ground leads to only the layers providing return paths, and use vias to stitch any remaining islands? #Electronics #StackUp

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