Mastodawn

Interestingly, the thick infill area was way more resistant to the lapping process and the majority of metal-3 remained there, while the rest got stripped off.

There is a lot of analog circuitry on the bottom and right sides of the chip. I am not sure why there is so much and what it does exactly.

A detail view on the analog section; the features on the right seem to be four resistor arrays of the same value, and those on the left are multiple capacitors connected in parallel. I wonder why they decided to make multiple separate parts instead of making a large one of required geometry.

A detail view of the sea of gates. Note the difference in the shade of blue.

The smaller memory array in bottom left is certainly an SRAM block.

Andrew Zonenberg

@infosecdj What node is this? You're getting beautifully sharp optical images indicating it's nowhere near at the limits of optical resolution, yet it's also multiple metal layers, standard cell based, planarized, etc. That's not a combo I see too often.

@azonenberg If only I knew. This certainly seems to be on the larger side, as everything is very well resolved indeed, at least on metal layers. Poly might get close to the limits of at least my system, the ROM is challenging to resolve well.

Andrew Zonenberg 3d ago

@infosecdj it feels like 350 give or take a node

@azonenberg I measured the metal-1 wire width, which came in about 677nm. Poly wiring looks about the same width. Again, a large margin of error as it is only about 13 pixels wide and the setup is not perfectly calibrated.