Radxa AICore DX-M1M M.2 2242 low-power AI module delivers 25 TOPS of edge AI performance for just 3W of power
Radxa AICore DX-M1M is a compact, low-power M.2 edge AI acceleration module built around the DeepX DX-M1M neural processing unit (NPU) and delivers up to 25 TOPS (INT8) of AI performance while consuming only 3W of power. Designed for industrial robot arms, autonomous mobile robots (ARM), edge servers, drones, and AIoT devices, the module delivers high-performance AI and ML capabilities without blowing the power budget. It relies on a PCIe Gen3 x2 interface and works with both x86 and Arm systems, including the Raspberry Pi 5 and Radxa ROCK SBCs. AICore DX-M1M specifications: AI Accelerator – DeepX DX-M1M neural processing unit (NPU) with up to 25 TOPS AI System Memory – 1GB LPDDR4X @ 4266 MT/s (on-chip, supports up to 8GB according to DeepX) Storage – 1Gbit QSPI NAND / NOR flash Host Interface - PCIe Gen 3.0 x4 (supports Gen 1/2/3 and x1/x2) via M.2 M + B Key connector
PycoClaw – A MicroPython-based OpenClaw implementation for ESP32 and other microcontrollers
PycoClaw is a MicroPython-based platform for running AI agents on ESP32 and other microcontrollers that brings OpenClaw workspace-compatible intelligence to resource-constrained embedded devices. We had already covered the C-based Miniclaw for ESP32-S3 SoCs, the PycoClaw's developer (Jonathan Peace) told CNX Software that it is a "full OpenClaw-compliant agent" that supports more LLM providers (OpenAI, Gemini, Ollama, etc.), interfaces with not only Telegram, but also ScriptO Studio and WebRTC, and offers features like OTA updates, extensions, and battery-optimized operation. The table below compares PycoClaw to OpenClaw, Nanobot, PicoClaw, NullClaw, and MimiClaw. MimiClaw still offers the lowest footprint and highest efficiency, but PycoClaw appears to offer many more features, including improved GPIO support. It works on ESP32-S3 with at least 8MB flash and PSRAM, ESP32-P4, and should soon support Raspberry Pi RP2350 boards with PSRAM as well. PycoClaw can be installed on supported hardware through a "one-click install" using a compatible web
High-end 25MP global shutter camera with 10GbE interface is designed for NVIDIA Holoscan platform
Leopard Imaging LI-IMX530-10GigE-NL is a high-end 25MP global shutter camera designed specifically for the NVIDIA Holoscan edge AI platform. The camera utilizes a 10GbE interface for high-bandwidth, low-latency data transmission, making it suitable for gesture recognition, iris scanning, head roll, and eye tracking. At the core of the camera module is the Sony IMX530, a 1.2-inch CMOS sensor with 5328 × 4608 resolution and a 2.74 μm pixel size. The sensor data is handled by a Lattice CertusPro-NX FPGA, and a Marvell 10GbE PHY takes care of high-bandwidth data transfer to GPU systems. The camera supports NVIDIA Jetson AGX Orin, IGX Orin, and Thor platforms. LI-IMX530-10GigE-NL specifications: FPGA – Lattice CertusPro-NX FPGA 52K to 96K logic cells 7.3 Mb total embedded memory External LPDDR4 memory support Up to 156x (18 x 18) multipliers within sysDSP blocks for AI/ML workloads 10 Gigabit Ethernet PCS blocks Image sensor Sony IMX530 Diagonal 19.3 mm
ADLINK DLAP-701 – An NVIDIA Jetson T5000/T4000 Edge AI platform for humanoid robots and vision sensing systems
ADLINK has just launched the DLAP-701 Series, a NVIDIA Jetson T5000/T4000-based compact edge AI platform designed for humanoid robots, autonomous mobile robots (AMR), and vision sensing systems (VSS). It supports up to 128GB LPDDR5X memory and features various I/O options, including dual Gigabit Ethernet, a QSFP port supporting 4×25GbE LAN, multiple USB 3.2 ports, and HDMI output, along with M.2 slots for Wi-Fi 6, 5G, and NVMe storage, as well as an mPCIe slot. It also integrates CAN-FD interfaces for robotics and vehicle control and TPM 2.0 security. With an operating voltage range of 9-36V DC and an industrial temperature range of -20°C to 60°C, it is designed for demanding edge environments. ADLINK DLAP-701 specifications Supported system-on-module – NVIDIA Jetson Thor T5000 or Jetson Thor T4000 Memory – Up to 128GB (T5000 variant), 64 GB (T4000 variant) 256-bit LPDDR5X (273 GB/s bandwidth) Storage 128GB SSD for the OS (most probably ADLINK's ASD+ industrial
MediaTek unveils 50 TOPS Genio Pro 5100 Cortex-X925/X4/A720 SoC, 7.2 TOPS Genio 420 Cortex-A78/A55 SoC for AIoT applications
After launching the Genio 360/360P hexa/octa-core SoCs last month, MediaTek has now expanded the lineup with the Genio Pro 5100 and Genio 420 AIoT SoCs at Embedded World 2026. The Genio Pro 5100 is a 3nm SoC with an "all big-core" architecture and a 50+ TOPS NPU for Edge AI applications. The Genio 420, on the other hand, is a cost-efficient 6nm platform designed for smart home, retail, and industrial IoT devices. MediaTek Genio Pro 5100 The Genio Pro 5100 integrates one Cortex-X925, three Cortex-X4, and four Cortex-A720 cores, as well as an Arm Immortalis-G925 GPU, and supports LPDDR5X memory up to 8533 Mbps. It can handle up to three 4K displays, up to 16 cameras via virtual channels, and 8K30 video encode/decode, and offers interfaces such as PCIe Gen4, USB 3.2 Gen2, USB 2.0, and dual 2.5GbE MAC. Genio Pro 5100 (MT8894) specifications: CPU - 8-core Arm v9.2 processor
SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC
We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for "systems in motion," such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series
AMD Ryzen AI Embedded P100 series expands with up to 12 Zen 5 cores, 80 TOPS of AI performance
At CES 2026, we saw AMD launch its new Ryzen AI Embedded P100 series of SoCs, with four- and six-core models designed for Edge AI. At the time of writing, the lineup had six SKUs, with higher-core variants to be announced later. Now at Embedded World 2026, AMD has expanded the Ryzen AI Embedded P100 series with six additional SKUs available in commercial and industrial temperature grades, while the automotive-grade SoCs remain unchanged. The new SOCs integrate 8-12 Zen 5 CPU cores (upgrade from 4-6 cores ), RDNA 3.5 graphics, and an XDNA 2 NPU on a single chip to deliver up to 80 TOPS (upgrade from 50 TOPS) of combined/system AI performance AMD claims up to 39% higher multithreaded CPU performance and 2.1× higher total system TOPS compared to Ryzen Embedded 8000 Series. They support unified CPU-GPU memory, enabling low-latency processing for tasks such as multi-camera machine vision, Visual
cnx-software.com
The New Yorker
