Opera ganha nova função de volume que resolve o som baixo dos teus vídeos
🔗 https://tugatech.com.pt/t82452-opera-ganha-nova-funcao-de-volume-que-resolve-o-som-baixo-dos-teus-videos
Opera ganha nova função de volume que resolve o som baixo dos teus vídeos
🔗 https://tugatech.com.pt/t82452-opera-ganha-nova-funcao-de-volume-que-resolve-o-som-baixo-dos-teus-videos
Ezurio Tungsten 510/700 SMARC SoM features MediaTek Genio 510/700 AIoT SoC, dual GbE, WiFi 6

Ezurio Tungsten 510 and Tungsten 700 SMARC 2.1 compliant system-on-module powered by MediaTek Genio 510 hexa-core and Genio 700 octa-core Cortex-A78/A55 AIoT SoCs with an up to 4 TOPS NPU. The SMARC modules feature 4GB or 8GB LPDDR4 memory and 16GB flash by default (upgradeable up to 128GB), offer dual Gigabit Ethernet, WiFi 6 and Bluetooth 5.2 connectivity, and various interfaces exposed through a standard 314-pin MXM connector, including HDMI, DisplayPort, eDP, and MIPI DSI display interfaces, two MIPI CSI camera interfaces, two I2S audio interface, PCIe Gen2 x1, and more. Ezurio Tungsten 510/700 specifications: SoC (one or the other) MediaTek Genio 510 (MT8370) CPU - Hexa-core processor with 2x Arm Cortex-A78 core up to 2.2 GHz, 4x Cortex-A55 cores up to 2 GHz GPU - Arm Mali-G57 MC2 GPU VPU - 4Kp60 H.265, AV1, VP9, H.264 video decoding, 4Kp30 H.265 and H.264 video encoding Accelerators - Up to 3.2
Wine 11.7 introduz som surround 7.1 para aplicações Windows
🔗 https://tugatech.com.pt/t82290-wine-11-7-introduz-som-surround-7-1-para-aplicacoes-windows
DongshanPI K510 SoM appears with dual RISC-V cores and AI acceleration
Boardcon Tiny1126B is a smaller and lighter Rockchip RV1126B system-on-module, yet with more I/Os

Boardcon Tiny1126B shrinks the company's MINI1126B-P Rockchip RV1126B system-on-module (SoM) from 38x30mm to 34x30mm, targeting even more compact AI vision systems such as smart cameras, smart door locks, inspection cameras, cleaning/logistics robots, DMS (Driver Monitoring Systems), BSD (Blind Spot Detection) solutions, and smart displays. Despite its smaller size, the Tiny1126B features two 0.4mm pitch 100-pin connectors, instead of two 0.5mm pitch 80-pin connectors for its predecessors, offering even more I/Os. It's notably gaining a USB 3.0 DRD (Dual-Role Device) interface, an extra SDMMC interface, one additional SPI and I2C interfaces, Fast Ethernet, and more. The rest of the specifications, including memory capacity (up to 4GB LPDDR5) and storage (up to 256GB eMMC flash), remain the same. Boardcon Tiny1126B system-on-module Boardcon Tiny1126B specifications: SoC – Rockchip RV1126B CPU – Quad-core Arm Cortex-A53 up to 1.6 GHz with 32KB L1 I-Cache and 32KB L1 D-Cache, unified 512KB L2 Cache GPU – 2D
Samsung revoluciona o controlo de som com o novo Audio Eraser em tempo real no Galaxy S26
🔗 https://tugatech.com.pt/t82049-samsung-revoluciona-o-controlo-de-som-com-o-novo-audio-eraser-em-tempo-real-no-galaxy-s26
ADLINK OSM-MTK520 – A MediaTek Genio 520-based OSM Size-L system-on-module

ADLINK OSM-MTK520 is a 45 x 45mm OSM Size-L system-on-module (SoM) powered by a MediaTek Genio 520 AIoT processor with a 10 TOPS NPU for Edge AI workloads. It's basically an upgrade to the company's OSM-MTK510 OSM Size-L module with a Genio 510 hexa-core SoC (3.2 TOPS NPU), up to 32GB eMMC flash, and 8GB LPDDR4 with a Genio 520 octa-core SoC (10 TOPS NPU), up to 256GB or 512GB UFS 3.1 storage, and up to 16GB LPDDR5 memory. There are also some minor changes to I/Os with an extra USB OTG interface, DisplayPort instead of HDMI, an extra MIPI CSI camera interface, fewer I2C interfaces, and more GPIOs. ADLINK OSM-MTK520 specifications: SoC – MediaTek Genio 520 (MT8371) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU up to 880 MHz
Redmi revela o trunfo do K Pad 2 e o detalhe no sistema de som vai transformar os teus videojogos
🔗 https://tugatech.com.pt/t81905-redmi-revela-o-trunfo-do-k-pad-2-e-o-detalhe-no-sistema-de-som-vai-transformar-os-teus-videojogos