#Intel Jumps On Board #ElonMusk’s Terafab Chipmaking -
https://kensbookinfo.blogspot.com/p/etc-varied.html#6

HR 8176 (IH) - #Moldova Support Act -
https://kensbookinfo.blogspot.com/p/news.html#12

#Health NGOs warn of imminent family planning crisis -
https://kensbookinfo.blogspot.com/p/etc.html#Ghana

#Arizona Corporation Commission To Host Summer Preparedness -
https://kensbookinfo.blogspot.com/p/etc-states.html#3

#Trump says #Lebanon not included in #US-Iran ceasefire -
https://kensbookinfo.blogspot.com/p/etc.html#UAE

View all news from the markets https://kensbookinfo.blogspot.com/2026/03/latest-news-from-markets.html

Intel alia-se à SambaNova para otimizar o processamento de inteligência artificial
🔗 https://tugatech.com.pt/t81547-intel-alia-se-a-sambanova-para-otimizar-o-processamento-de-inteligencia-artificial

#artificial #intel 

undefined | 5 Burning Questions About Elon Musk’s Terafab Chip Partnership with Intel by Lauren Goode, Paresh Dave

Intel’s chief executive announced that the chipmaker will “work closely” with Elon Musk on his ambitious Terafab project — a multi‑location, terawatt‑scale chip‑fabrication operation that would serve SpaceX, Tesla and Musk’s broader AI and robotics ambitions. The partnership was highlighted by a photo of Musk and Intel CEO Lip‑Bu Tan shaking hands in front of an Intel sign, but the details remain vague. Intel says its ability to design, fabricate and package ultra‑high‑performance chips at scale will help accelerate a goal of producing one terawatt of computing power a year, while Musk has long spoken of needing an in‑house fab to meet the massive chip demand of his companies.

Analysts are questioning what the deal actually entails. No SEC filings have been made, suggesting the agreement may be limited to handshakes for now, and Intel’s public statement offers little specificity. The most likely contribution appears to be Intel’s advanced‑packaging expertise, allowing Tesla to use Intel’s process‑design kits without upsetting existing relationships with TSMC. At the same time, Musk is expected to demand heavy customization—Tesla previously designed its own A16 chip with Samsung’s manufacturing support, and similar licensing or co‑development arrangements are anticipated with Intel. Ownership of the resulting intellectual property is also unclear; Intel would likely retain rights to the manufacturing know‑how while Musk’s teams would create their own “recipe” for chip production.

Even if the technical collaboration can be defined, practical hurdles loom. Musk has not disclosed where the Terafab will be built, though construction is underway on a massive chip‑design lab at Tesla’s Austin campus, and Texas faces a shortage of skilled tradespeople needed for semiconductor factories. Labor scarcity, safety concerns from past Gigafactory projects, and the competitive bidding for construction crews could slow progress. Intel’s reputation for safer, more sustainable site practices may help mitigate some of these risks, but analysts remain skeptical about whether a brand‑new, end‑to‑end fab of this scale can be realized in the near term.

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#elonmusk #intel #terafab #tesla

Punto Informatico: Terafab: Intel fornirà aiuto per la costruzione

Intel offrirà le sue competenze nella progettazione e produzione dei chip alle aziende di Elon Musk per la costruzione della Terafab in Texas.
The post Terafab: Intel fornirà aiuto per la costruzione appeared first on Punto Informatico.

Terafab: Intel will provide support for construction.

Intel will offer its expertise in chip design and production to Elon Musk’s companies for the construction of the Terafab in Texas.
The post Terafab: Intel to Provide Assistance for Construction appeared first on Punto Informatico.

#Terafab #Intel #ElonMusk’s #Texas #first #PuntoInformatico

https://www.punto-informatico.it/terafab-intel-fornira-aiuto-costruzione/

The art of holding a grudge...

I just stumbled across this brilliant reply from an Intel Product Support forum. The ensuing conversation is also very entertaining 😆

https://community.intel.com/t5/Wireless/Intel-AX200-bluetooth-won-t-work-on-Linux/td-p/1599056

#intel #linux #funny

Fim de uma Era: Linux 7.1 Prepara-se para Dizer Adeus ao Processador Intel 486
🔗 https://tugatech.com.pt/t81517-fim-de-uma-era-linux-7-1-prepara-se-para-dizer-adeus-ao-processador-intel-486

#intel #linux #processador 

undefined | AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Advanced packaging – the process that connects multiple dies into a single, larger chip – is rapidly becoming the next choke‑point for artificial‑intelligence hardware. Historically performed in Asia, the step is now in short supply as AI workloads demand ever‑higher density, performance and efficiency. TSMC’s most advanced method, Chip‑on‑Wafer‑on‑Substrate (CoWoS), is growing at an 80 % compound‑annual rate, and Nvidia has booked the bulk of the available capacity. Intel, which already does much of its final packaging in Vietnam, Malaysia and China, is expanding its U.S. footprint with facilities in New Mexico, Oregon and Arizona, and is courting customers such as Amazon, Cisco, SpaceX and Tesla for custom‑chip packaging.

Both TSMC and Intel are racing to supply the U.S. market. TSMC is constructing two new packaging plants in Arizona and two more in Taiwan, while still routing 100 % of its chips to Taiwan for final assembly. Intel’s embedded multi‑die interconnect bridge (EMIB) offers a cost‑effective alternative to CoWoS, and its recent tour of an Arizona packaging fab showed customers already using the service. The proximity of packaging to fab sites promises shorter turnaround times and lower logistics risk, a benefit that especially appeals to large AI investors like Nvidia and Elon Musk’s upcoming Terafab projects.

Looking beyond 2.5‑D, the industry is already developing true 3‑D solutions. TSMC’s System‑on‑Integrated‑Chip (SoIC) and Intel’s Foveros Direct aim to stack dies vertically, creating a single “chip‑like” entity with dramatically higher performance. Memory makers such as Samsung, SK Hynix and Micron are also advancing 3‑D packaging for high‑bandwidth memory, while hybrid bonding techniques replace traditional bumps with copper pads to further shrink interconnect distances. These innovations, together with the surge in advanced‑packaging capacity, will shape the next wave of AI hardware and determine whether the supply chain can keep up with the exploding demand for compute.

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#tsmc #nvidia #intel