Why Thermodynamics Rules Future Orbital Data Centers

https://spectrum.ieee.org/orbital-data-centers-heat

#HackerNews #thermodynamics #orbitaldatacenters #spaceinnovation #heatmanagement

Tom’s Hardware: 3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds pr. “A research team comprising boffins from the Danish Technological Institute and the Heatflow company have come up with a 3D-printed cooler that can draw a whopping 600 W off a chip fully passively, without any pumps or fans, 3D […]

𝐀 𝐂𝐨𝐦𝐩𝐥𝐞𝐭𝐞 𝐒𝐭𝐮𝐝𝐲 𝐆𝐮𝐢𝐝𝐞 𝐭𝐨 𝐋𝐄𝐃 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠

📚𝐆𝐞𝐭 𝐒𝐚𝐦𝐩𝐥𝐞 𝐂𝐨𝐩𝐲
https://www.theinsightpartners.com/reports/led-packaging-market

#LED #LEDPackaging #Optoelectronics #LightingTech #EnergyEfficient #SmartLighting #Electronics #Semiconductor #HeatManagement #LightOutput #Durability #Innovation #ChipProtection #ModernTech #LEDDesign

TechXplore: Passive cooling paint sweats off heat to deliver 10X cooling and 30% energy savings. “This design enabled [the paint] to achieve superior cooling by combining both radiative, evaporative and reflective cooling mechanisms, which allowed it to reflect 88–92% of sunlight, emit 95% of the heat as infrared radiation, and hold about 30% of its weight in water, making it a paint ideal […]

https://rbfirehose.com/2025/06/21/techxplore-passive-cooling-paint-sweats-off-heat-to-deliver-10x-cooling-and-30-energy-savings/

Carnegie Mellon: Thermal interface material slashes AI data center cooling cost and GPU/CPU power use. “Today, up to 40% of data center power use comes from cooling high-power chips—an astounding amount equivalent to the state of California’s entire electricity consumption. To combat this, Sheng Shen, professor of Mechanical Engineering at Carnegie Mellon University has developed an […]

https://rbfirehose.com/2025/02/06/carnegie-mellon-thermal-interface-material-slashes-ai-data-center-cooling-cost-and-gpu-cpu-power-use/