A Samsung reduziu em 50% a força de trabalho em suas fábricas de semicondutores. A medida ocorre em meio a negociações trabalhistas e um cenário de paralisações na Coreia do Sul.
🔹 Foco na automação
🔹 Impacto na produção global de chips
🔹 Gestão de RH
Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27
📰 Original title: Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology
🤖 IA: It's not clickbait ✅
👥 Users: It's not clickbait ✅
View full AI summary: https://en.killbait.com/samsung-exynos-2700-to-use-side-by-side-packaging-instead-of-wlp-for-galaxy-s27.html?utm_source=mastodon_world&utm_medium=social&utm_campaign=killbait.mastodon_world
Samsung's upcoming Exynos 2700 chipset, expected to power the Galaxy S27 and S27+, may feature a significant change in its packaging design. The company is reportedly moving away from Fan-Out Wafer-Level Packaging (FOWLP), a technology previously used in the Exynos 2400. While FOWLP improved thermal performance, its complex and costly manufacturing process made it less profitable for Samsung. The new architecture, called Side-by-Side (SbS), places the application processor (AP) and DRAM next to each other on the substrate, rather than stacking them. This design is intended to simplify production and reduce costs. Additionally, Samsung plans to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which is expected to enhance heat dissipation and overall thermal efficiency. The Galaxy S27 series is anticipated to launch in early 2027, and the performance and efficiency of the Exynos 2700’s new packaging will be closely observed by tech enthusiasts. Overall, the change marks a strategic move to balance performance improvements with cost-effective production.
Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27
📰 Original title: Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology
🤖 IA: It's not clickbait ✅
👥 Users: It's not clickbait ✅
View full AI summary: https://en.killbait.com/samsung-exynos-2700-to-use-side-by-side-packaging-instead-of-wlp-for-galaxy-s27.html?utm_source=mastodon_social&utm_medium=social&utm_campaign=killbait.mastodon_social
Samsung's upcoming Exynos 2700 chipset, expected to power the Galaxy S27 and S27+, may feature a significant change in its packaging design. The company is reportedly moving away from Fan-Out Wafer-Level Packaging (FOWLP), a technology previously used in the Exynos 2400. While FOWLP improved thermal performance, its complex and costly manufacturing process made it less profitable for Samsung. The new architecture, called Side-by-Side (SbS), places the application processor (AP) and DRAM next to each other on the substrate, rather than stacking them. This design is intended to simplify production and reduce costs. Additionally, Samsung plans to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which is expected to enhance heat dissipation and overall thermal efficiency. The Galaxy S27 series is anticipated to launch in early 2027, and the performance and efficiency of the Exynos 2700’s new packaging will be closely observed by tech enthusiasts. Overall, the change marks a strategic move to balance performance improvements with cost-effective production.
Galaxy A56 (256 GB) tem 46% OFF na Amazon em oferta com cupom de R$ 100
Galaxy A57 (256 GB) já atinge 34% OFF na melhor oferta desde lançamento
Samsung's foldable strategy is taking an unexpected turn 📱 New source code reveals the Galaxy Z Fold8 and Z Flip8 could run on different chipsets, marking a shift from the company's traditional approach. The Flip8 might offer both Exynos and Snapdragon variants, while the Fold8 stays exclusive. Read the article to discover what's driving this decision.
https://true-tech.net/samsung-galaxy-z-fold8-z-flip8-chipset-strategy/
#Samsung #GalaxyZFold8 #GalaxyZFlip8 #Exynos #Snapdragon
https://true-tech.net/samsung-galaxy-z-fold8-z-flip8-chipset-strategy/
Galaxy Tab S10 Lite 5G atinge menor preço histórico com cupom na Amazon
Samsungs kommendes Top-SoC für High-End-Smartphones ist erstmals in einer Benchmark-Datenbank aufgetaucht. Der sogenannte "Exynos 2700" wurde offenbar auf einem Entwickler-Board getestet und deutet schon jetzt an, dass Samsung bei seinem Prozessor für das Galaxy S27 einiges anders machen will.
Samsung、Galaxy S25で採用予定のExynos 2500は第2世代3nm GAAプロセスで製造され、Snapdragon 8 Gen 4を上回る性能を示す可能性
Samsung独自のExynosチップはしばらく冬の時代を迎えた後、今年発売のGalaxy S24シリーズで搭載された「Exynos 2400」で評判を取り戻した。とは言え、それは前モデルに比べて優れていると言うものであり、Android向けAPでトップを走るQualcommのSnapdragonと比較した場合まだまだ劣勢である事には変わりがない。だが次期Exynos 2500ではこの状況が変わる可能性があるようだ。 3nm […]
SamsungはExynosプロセッサ内部にヒートシンクを搭載し放熱を強化する技術を開発中
SamsungのExynosプロセッサは何年も発熱に悩まされてきているが、同社は次世代Exynosチップの発熱問題解決に向けて、新たな冷却技術を取り入れる可能性が明らかになった。この新技術は、PCやサーバーで使用されている高性能な放熱技術をスマートフォン向けに最適化したもので、次世代Exynosプロセッサの性能向上と発熱抑制に大きな期待が寄せられている。 Samsungの新冷却技術「FOWLP-HPB」とは Samsungの今年のExynos […]
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