Mastodawn

🆕Xiaomi nie zwalnia tempa! Xring O3 ma być kolejnym krokiem w walce z Qualcommem i MediaTekiem
➡️https://rootblog.pl/xiaomi-pracuje-nad-procesorem-xring-o3/

#chipset #MediaTek #Qualcomm #Xiaomi #XringO3

eddieoz Jun 2

Isso muda o jogo: chipset que desafia a Apple

E se um novo chipset abrir uma era que desafia a Apple? 🤯

- Isso muda o jogo: um chipset que pode trazer uma nova geração de laptops ao mercado 💥
- Laptops mais potentes, rodando jogos no full — desempenho que chama atenção para competir com a linha Apple 🎮⚡
- Microsoft e fabricantes provavelmente vão investir pesado — fornecedor e indústria entrando no jogo 💸🔧
- Pode estar se abrindo...

#chipset #Apple #laptops #Microsoft #mercado #MorningCrypto

TugaTech 🖥️May 19

AMD lança novos drivers de chipset para os processadores Ryzen AI 400
🔗 https://tugatech.com.pt/t83886-amd-lanca-novos-drivers-de-chipset-para-os-processadores-ryzen-ai-400

#ai #amd #chipset #lan #os #ryzen

AMD lança novos drivers de chipset para os processadores Ryzen AI 400

A AMD disponibilizou uma nova atualização para os seus drivers de chipset, focada em otimizar o desempenho de sistemas suportados no Windows 10 e Windows 11. Es

TugaTech

KillBait News May 16

Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27

📰 Original title: Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology

🤖 IA: It's not clickbait ✅
👥 Users: It's not clickbait ✅

View full AI summary: https://en.killbait.com/samsung-exynos-2700-to-use-side-by-side-packaging-instead-of-wlp-for-galaxy-s27.html?utm_source=mastodon_world&utm_medium=social&utm_campaign=killbait.mastodon_world

#technology #samsung #exynos #chipset

Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27

Samsung's upcoming Exynos 2700 chipset, expected to power the Galaxy S27 and S27+, may feature a significant change in its packaging design. The company is reportedly moving away from Fan-Out Wafer-Level Packaging (FOWLP), a technology previously used in the Exynos 2400. While FOWLP improved thermal performance, its complex and costly manufacturing process made it less profitable for Samsung. The new architecture, called Side-by-Side (SbS), places the application processor (AP) and DRAM next to each other on the substrate, rather than stacking them. This design is intended to simplify production and reduce costs. Additionally, Samsung plans to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which is expected to enhance heat dissipation and overall thermal efficiency. The Galaxy S27 series is anticipated to launch in early 2027, and the performance and efficiency of the Exynos 2700’s new packaging will be closely observed by tech enthusiasts. Overall, the change marks a strategic move to balance performance improvements with cost-effective production.

KillBait

KillBait May 16

Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27

📰 Original title: Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology

🤖 IA: It's not clickbait ✅
👥 Users: It's not clickbait ✅

View full AI summary: https://en.killbait.com/samsung-exynos-2700-to-use-side-by-side-packaging-instead-of-wlp-for-galaxy-s27.html?utm_source=mastodon_social&utm_medium=social&utm_campaign=killbait.mastodon_social

#technology #samsung #exynos #chipset

Samsung Exynos 2700 to Use Side-by-Side Packaging Instead of WLP for Galaxy S27

Samsung's upcoming Exynos 2700 chipset, expected to power the Galaxy S27 and S27+, may feature a significant change in its packaging design. The company is reportedly moving away from Fan-Out Wafer-Level Packaging (FOWLP), a technology previously used in the Exynos 2400. While FOWLP improved thermal performance, its complex and costly manufacturing process made it less profitable for Samsung. The new architecture, called Side-by-Side (SbS), places the application processor (AP) and DRAM next to each other on the substrate, rather than stacking them. This design is intended to simplify production and reduce costs. Additionally, Samsung plans to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which is expected to enhance heat dissipation and overall thermal efficiency. The Galaxy S27 series is anticipated to launch in early 2027, and the performance and efficiency of the Exynos 2700’s new packaging will be closely observed by tech enthusiasts. Overall, the change marks a strategic move to balance performance improvements with cost-effective production.

KillBait

Mashable India [Unofficial]Apr 24

Intel Just Made Everyday Computing More Powerful With Its New Chipset: Here's How

https://fed.brid.gy/r/https://in.mashable.com/tech/108922/intel-just-made-everyday-computing-more-powerful-with-its-new-chipset-heres-how

TugaTech 🖥️Mar 10

AMD lança novos drivers de chipset com suporte oficial para o Windows 11 25H2
🔗 https://tugatech.com.pt/t79842-amd-lanca-novos-drivers-de-chipset-com-suporte-oficial-para-o-windows-11-25h2

#amd #chipset #lan #oficial #suporte #windows

AMD lança novos drivers de chipset com suporte oficial para o Windows 11 25H2

A fabricante disponibilizou a versão 8.02.18.557 dos seus drivers de chipset, uma atualização que se revela fundamental para quem utiliza sistemas baseados em p

TugaTech