Ofertas do dia: caixa Boombox 4 da JBL com até 47% de desconto
Ofertas do dia: caixa Boombox 4 da JBL com até 47% de desconto
Ofertas 5.5 Mercado Livre: caixa Boombox da JBL com até 41% de desconto
Boardcon PICOT536 SoM and EMT536 SBC feature Allwinner T536 Edge AI processor

Back in April last year, Allwinner released the T536 SoC, and since then, we’ve seen MYiR Tech and Forlinx introduce SoM and SBC based on it. The latest to join the lineup is Boardcon, which has recently launched the PICOT536 SoM and EMT536 SBC for industrial HMI, machine vision, robotics, and other edge computing applications. As a reminder, the Allwinner T536 SoC features a quad-core Arm Cortex-A55 CPU, XuanTie E907 and E902 RISC-V coprocessors, and a 2 TOPS NPU for edge AI. The module comes with up to 8GB LPDDR4/LPDDR4X memory, up to 64GB eMMC flash, an optional WiFi 6 and Bluetooth 5.4 module, and a 314-pin MXM edge connector exposing I/Os such as MIPI DSI and LVDS, camera inputs, audio inputs and outputs, Gigabit Ethernet, PCIe, USB 3.0, and more. PICOT536 System-on-Module PICOT536 specifications: SoC – Allwinner T536 CPU – Quad-core Arm Cortex-A55 at up to 1.6GHz, RISC-V XuanTie
Forlinx UP4 – A 40×40 mm LCC + LGA system-on-module family with Rockchip, NXP, and Allwinner CPU options

Forlinx Embedded UP4 is a new family of pin-to-pin compatible system-on-modules currently offered with Rockchip RK3568J/RK3562J, NXP i.MX 9352, or Allwinner T527N/T536 processors. The UP4 modules measure just 40x40 mm and expose 487 pins through a hybrid LCC (Leadless Chip Carrier) and LGA (Land Grid Array) design with 1.0mm contact pitch and 1.27mm ball pitch, respectively. This should allow companies to design a single carrier board for multiple CPU variants. Forlinx UP4 specifications: SoC FET-MX9352-UP4 - NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7 GHz, Cortex-M33 real-time core @ 250 MHz, 2D GPU only, 0.5 TOPS Arm Ethos U65 microNPU FET3568-UP4 - Rockchip RK3568B2/J with 4x Arm Cortex-A55 cores @ up to 2.0/1.8 GHz, Arm Mali-G52 MP2 3D GPU, 1 TOPS AI NPU FET3562J-UP4 - Rockchip RK3562J with 4x Arm Cortex-A53 cores @ 1.8 GHz, Arm Mali-G52-2EE 3D GPU, 1 TOPS NPU FET527N-UP4 - Allwinner T527N
Oferta do dia: caixa de som Xtreme 4 da JBL com 59% de desconto
Rockchip RK3326-S quad-core Cortex-A35 SBC targets smart audio devices

Boardcon EM3326S is a single board computer powered by a Rockchip RK3326-S quad-core Cortex-A35 processor paired with up to 4GB LPDDR4 memory and 128GB eMMC flash. With a 3.5mm audio jack and a speaker connector, Fast Ethernet, WiFi, and Bluetooth connectivity, the company says the board mainly targets smart audio applications. But it could certainly be used for a wider range of applications with RGB LCD and MIPI DSI display interfaces, MIPI CSI and DVP camera interfaces, an RS485 terminal block, a mini PCIe socket plus a SIM card slot for 4G LTE connectivity, and more. Boardcon EM3326S specifications: SoC - Rockchip RK3326-S CPU - Quad-core Cortex-A35 @ 1.5GHz with 512KB L2 cache GPU - Arm Mali G31-2EE with support for OpenGL ES 1.1/2.0/3.2, DirectX 11 FL9_3, OpenCL 2.0, and Vulkan 1.0 VPU Video Decoder - MPEG-4, H.264, H.265/HEVC, VP8, VC-1 up to 1080p60 Video Encoder - H.264 video encoder
Domingo dos vídeos: Um Mac clássico vira um sintetizador.
https://retropolis.com.br/2026/04/26/domingo-dos-videos-um-mac-classico-vira-um-sintetizador/
#MundoRetro #DomingoDosVdeos #Macintosh #MacintoshClassic #MIDI #sintetizador #Som

https://www.youtube.com/watch?v=gliJVwzRifA Essa vem do canal 1Bit Fever Dreams, do YouTube. Ele fez um programa, chamado FireJam, onde ele faz um Mac compacto ser o centro da produção musical. Logo, cliques no mouse, toques no teclado e o uso de um teclado MIDI podem ser usados para compor música. O som pode sair pelo alto-falante do
Opera ganha nova função de volume que resolve o som baixo dos teus vídeos
🔗 https://tugatech.com.pt/t82452-opera-ganha-nova-funcao-de-volume-que-resolve-o-som-baixo-dos-teus-videos
Ezurio Tungsten 510/700 SMARC SoM features MediaTek Genio 510/700 AIoT SoC, dual GbE, WiFi 6

Ezurio Tungsten 510 and Tungsten 700 SMARC 2.1 compliant system-on-module powered by MediaTek Genio 510 hexa-core and Genio 700 octa-core Cortex-A78/A55 AIoT SoCs with an up to 4 TOPS NPU. The SMARC modules feature 4GB or 8GB LPDDR4 memory and 16GB flash by default (upgradeable up to 128GB), offer dual Gigabit Ethernet, WiFi 6 and Bluetooth 5.2 connectivity, and various interfaces exposed through a standard 314-pin MXM connector, including HDMI, DisplayPort, eDP, and MIPI DSI display interfaces, two MIPI CSI camera interfaces, two I2S audio interface, PCIe Gen2 x1, and more. Ezurio Tungsten 510/700 specifications: SoC (one or the other) MediaTek Genio 510 (MT8370) CPU - Hexa-core processor with 2x Arm Cortex-A78 core up to 2.2 GHz, 4x Cortex-A55 cores up to 2 GHz GPU - Arm Mali-G57 MC2 GPU VPU - 4Kp60 H.265, AV1, VP9, H.264 video decoding, 4Kp30 H.265 and H.264 video encoding Accelerators - Up to 3.2