Geniatech APC888 NXP i.MX 95-powered Edge AI Box PC takes M.2 AI accelerator from Hailo, MemryX, NXP, or DeepX
Geniatech APC888 Edge AI Box PC is powered by an NXP i.MX 95 Cortex-A55/M7/M33 applications processor, and features an M.2 socket for AI accelerator from Hailo, MemryX, DeepX, or Kinara (now NXP). The system comes with 4GB LPDDR5 and 32GB eMMC flash by default, features two Gigabit Ethernet ports, optional WiFi, Bluetooth, cellular, and GNSS connectivity, and two USB 3.0 ports. It's available in commercial and industrial temperature grades. Geniatech APC888 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 1080p60/4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder Decoding -
Forlinx UP4 – A 40×40 mm LCC + LGA system-on-module family with Rockchip, NXP, and Allwinner CPU options
Forlinx Embedded UP4 is a new family of pin-to-pin compatible system-on-modules currently offered with Rockchip RK3568J/RK3562J, NXP i.MX 9352, or Allwinner T527N/T536 processors. The UP4 modules measure just 40x40 mm and expose 487 pins through a hybrid LCC (Leadless Chip Carrier) and LGA (Land Grid Array) design with 1.0mm contact pitch and 1.27mm ball pitch, respectively. This should allow companies to design a single carrier board for multiple CPU variants. Forlinx UP4 specifications: SoC FET-MX9352-UP4 - NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7 GHz, Cortex-M33 real-time core @ 250 MHz, 2D GPU only, 0.5 TOPS Arm Ethos U65 microNPU FET3568-UP4 - Rockchip RK3568B2/J with 4x Arm Cortex-A55 cores @ up to 2.0/1.8 GHz, Arm Mali-G52 MP2 3D GPU, 1 TOPS AI NPU FET3562J-UP4 - Rockchip RK3562J with 4x Arm Cortex-A53 cores @ 1.8 GHz, Arm Mali-G52-2EE 3D GPU, 1 TOPS NPU FET527N-UP4 - Allwinner T527N
LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)
The LimeSDR Micro M.2 2280 software-defined radio (SDR) card combines an NXP LA9310 baseband processor and a Lime Microsystems LMS7002M transceiver, and targets integration into portable or embedded solutions with a spare M.2 PCIe Gen3 x1 socket. The module is offered in a 1T2R configuration by default, but can be expanded to 1T4R via an FPC connector, supports a 30 MHz to 3.8 GHz frequency range, and up to 100 MHz bandwidth. Target applications include 4G LTE/5G, future RAN research, custom user equipment/modems, drone communications, IoT, satellite communications, and custom waveform generation. LimeSDR Micro M.2 SDR card specifications: SoC – NXP LA9310 programmable baseband processor Vector Signal Processing Accelerator (VSPA) Gen 2 up to 80 GFLOPs Control Processor - Arm Cortex-M4 at up to 307 MHz Storage – 512 Kbit EEPROM memory for NXP LA9310 initial configuration RF Lime Microsystems LMS7002M RF transceiver Channels - 1T2R expandable to 1T4R via
Linux 7.0 has now been tagged, coming with 19 commits upstreamed from the Librem 5 tree - two by NXP and the rest by yours truly on behalf of @purism. Three more are already queued for 7.1.
While the mainline kernel still can't drive the display without extra patches, it's very close now 👀
#linuxmobile #mobilelinux #linux #kernel #librem5 #mainline #linuxphone #linuxsmartphone #shotonlibrem5 #purism #nxp #imx8mq #cats #catsofmastodon
Europe's microcontroller market leaders: Infineon, NXP, and STMicroelectronics
Three of five leading global microcontroller manufacturers are European; with Renesas and Microchip, they hold 80% of the market.
Mikrocontroller-Marktführer aus Europa: Infineon, NXP und STMicroelectronics
Drei der fünf weltweit führenden Hersteller von Mikrocontrollern sitzen in Europa; zusammen mit Renesas und Microchip halten sie rund 80 Prozent Marktanteil.
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Sebastian Krzyszkowiak
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