Engicam expands MicroGEA lineup with 25 × 25 mm NXP i.MX 93 module
Engicam expands MicroGEA lineup with 25 × 25 mm NXP i.MX 93 module
Forlinx UP4 – A 40×40 mm LCC + LGA system-on-module family with Rockchip, NXP, and Allwinner CPU options

Forlinx Embedded UP4 is a new family of pin-to-pin compatible system-on-modules currently offered with Rockchip RK3568J/RK3562J, NXP i.MX 9352, or Allwinner T527N/T536 processors. The UP4 modules measure just 40x40 mm and expose 487 pins through a hybrid LCC (Leadless Chip Carrier) and LGA (Land Grid Array) design with 1.0mm contact pitch and 1.27mm ball pitch, respectively. This should allow companies to design a single carrier board for multiple CPU variants. Forlinx UP4 specifications: SoC FET-MX9352-UP4 - NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7 GHz, Cortex-M33 real-time core @ 250 MHz, 2D GPU only, 0.5 TOPS Arm Ethos U65 microNPU FET3568-UP4 - Rockchip RK3568B2/J with 4x Arm Cortex-A55 cores @ up to 2.0/1.8 GHz, Arm Mali-G52 MP2 3D GPU, 1 TOPS AI NPU FET3562J-UP4 - Rockchip RK3562J with 4x Arm Cortex-A53 cores @ 1.8 GHz, Arm Mali-G52-2EE 3D GPU, 1 TOPS NPU FET527N-UP4 - Allwinner T527N
Geniatech AIM-M-K and AIM-B2 integrate Ara240 for local AI inference
LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)

The LimeSDR Micro M.2 2280 software-defined radio (SDR) card combines an NXP LA9310 baseband processor and a Lime Microsystems LMS7002M transceiver, and targets integration into portable or embedded solutions with a spare M.2 PCIe Gen3 x1 socket. The module is offered in a 1T2R configuration by default, but can be expanded to 1T4R via an FPC connector, supports a 30 MHz to 3.8 GHz frequency range, and up to 100 MHz bandwidth. Target applications include 4G LTE/5G, future RAN research, custom user equipment/modems, drone communications, IoT, satellite communications, and custom waveform generation. LimeSDR Micro M.2 SDR card specifications: SoC – NXP LA9310 programmable baseband processor Vector Signal Processing Accelerator (VSPA) Gen 2 up to 80 GFLOPs Control Processor - Arm Cortex-M4 at up to 307 MHz Storage – 512 Kbit EEPROM memory for NXP LA9310 initial configuration RF Lime Microsystems LMS7002M RF transceiver Channels - 1T2R expandable to 1T4R via
Forlinx FAI-ARA240-M Packs Ara240 NPU into M.2 2280 Module
Linux 7.0 has now been tagged, coming with 19 commits upstreamed from the Librem 5 tree - two by NXP and the rest by yours truly on behalf of @purism. Three more are already queued for 7.1.
While the mainline kernel still can't drive the display without extra patches, it's very close now 👀
#linuxmobile #mobilelinux #linux #kernel #librem5 #mainline #linuxphone #linuxsmartphone #shotonlibrem5 #purism #nxp #imx8mq #cats #catsofmastodon
F&S M.2 AI Accelerator Uses NXP Ara-240 for Edge Inference Workloads
Europe's microcontroller market leaders: Infineon, NXP, and STMicroelectronics
Three of five leading global microcontroller manufacturers are European; with Renesas and Microchip, they hold 80% of the market.
Mikrocontroller-Marktführer aus Europa: Infineon, NXP und STMicroelectronics
Drei der fünf weltweit führenden Hersteller von Mikrocontrollern sitzen in Europa; zusammen mit Renesas und Microchip halten sie rund 80 Prozent Marktanteil.
Looking to isolate your network traffic on #NXP i.MX1046 platform?
Our latest technical guide walks you through the step-by-step process of configuring VLANs (Virtual Local Area Networks) and 802.1Q tagging. By creating virtual interfaces, you can efficiently manage multiple broadcast domains on a single physical port, essential for secure and high-performance industrial networking.
Check out the full tutorial here
https://www.forlinx.net/article_view_791.html