All right, so, I have this mosfet which I expect to be dissipating a fair bit of power (several watts, potentially >10W). In the previous prototype I used a THT part (SO-247) with a bolt-on heatsink, which worked pretty well.
Ultimately I'd prefer to use a surface mount part, and the device is also available in D2pak-7.
My plan was attach the tab to an oversized pad, drop an array of thermal vias to the ground plane on the opposite side, and mount the entire (single-sided) board's ground plane on a shared heatsink.
The problem is the thermal tab on this device isn't connected to ground, but instead is the pin for Drain. So I can't drop thermal vias to the ground plane.
Is the expectation that I use a top-mount heatsink, dissipate heat through a big power plane for Drain on the board's front, or what?
datasheet https://www.qorvo.com/products/d/da008707