Reworked all the bridges on the ESD diodes that I found during initial visual inspection, and tidied up a few bulk caps.

Did continuity tests to sanity check on each power rail and nothing is shorted.

Gonna start populating the front side after the little one goes to sleep. Should go faster than the back since it's mostly large ICs not hundreds of 0402s.

Starting front side assembly. Paste print looks a lot nicer.

I usually begin top side assembly with large but flat components like BGAs so I don't risk knocking tiny stuff around while placing them. Then smaller passives and ICs, and tall capacitors and connectors last.

This FPGA is the single most expensive component I've ever put on a board. Shipping an entire tray for one chip might be slight overkill though...

All the BGAs and most of the big QFNs done. Still tons of tiny components left, but nowhere near as many as the back had!
Probably about half done. Time to take a stretch break.
@azonenberg are those antenna connectors as Test-Points?

@claudius U.FL for power rail test points specifically.

The Teledyne LeCroy RPxxxx series probes (I have an RP4030) are designed to interface to U.FL to provide high bandwidth ripple/noise measurements.

This board has almost 30 power domains hence the numerous U.FL's :)