Equinix plans to expand liquid cooling across 100 datacenters to manage the heat generated by powerful AI chips like Nvidia's H100 and AMD's MI300X. As demands for AI infrastructure increase, Equinix aims to make direct liquid cooling more cost-effective. This method involves passing coolant through hotspots on CPUs, GPUs, memory, and NICs, then rejecting heat to external cooling units. Liquid cooling is more power-efficient, potentially reducing up to 30% of a cabinet's power consumption attributed to fans. Equinix also explores rear door heat exchangers for air-cooled cabinets, enabling flexibility in transitioning to liquid cooling. Other providers like Digital Realty and Colovore have adopted similar technologies to support dense AI deployments, showcasing high rack densities of up to 250kW using direct liquid cooling.

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