Michel K.Jun 12

Samsung's HBM5 mockup is a reminder that next-gen AI memory isn't just a bandwidth race. Cooling the stack could be just as critical.

#tech #technology #samsung #hbm5 #aimemory #chippackaging

https://techshowup.com/News/Article/019ebdab-ef25-71a3-b8c4-aa9a1f380fa7/samsung-hbm5-mockup-puts-heat-path-block-at-the-center-of-ai

Samsung HBM5 Mockup Puts Heat Path Block at the Center of AI Memory Cooling

Samsung’s HBM5 mockup shows that next-gen AI memory is no longer just about bandwidth. Cooling the stack may be just as important as feeding the accelerator.

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tech news ᳇ eicker.newsDec 8, 2024
»#Intel looks beyond silicon, outlines breakthroughs in atomically-thin #2Dtransistors, #chippackaging, and #interconnects at IEDM 2024.« https://www.tomshardware.com/pc-components/cpus/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024?eicker.news #tech #media
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

Smaller, faster, better.

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