Rockchip RK3506J-based Forlinx FCU1501 fanless industrial IoT gateway offers dual Ethernet, plenty of I/Os and serial interfaces

https://fed.brid.gy/r/https://www.cnx-software.com/2026/03/31/rockchip-rk3506j-based-forlinx-fcu1501-fanless-industrial-iot-gateway-offers-dual-ethernet-plenty-of-i-os-and-serial-interfaces/

Rockchip RK3506J-based Forlinx FCU1501 fanless industrial IoT gateway offers dual Ethernet, plenty of I/Os and serial interfaces

Forlinx Technology has recently introduced the FCU1501, a rugged, fanless industrial embedded computer and IoT gateway built around the Rockchip RK3506J processor with a tri-core Cortex-A7 and a single Cortex-M0 core. The system is designed for high-reliability data acquisition and protocol conversion in harsh environments. The gateway comes in two variants (basic and extended), which have similar dimensions but differ mainly in interface density. Both models feature up to 512MB DDR3 RAM, 8GB eMMC flash, dual Fast Ethernet, dual-band Wi-Fi & Bluetooth 5.0, and 4G LTE Cat 1 support. Applications include automation, rail transit, and smart manufacturing. The system supports a wide industrial temperature range (-40°C to +85°C) and meets Level 3 EMC standards. Forlinx FCU1501 Specifications: SoC – Rockchip RK3506J CPU 3x Arm Cortex-A7 cores up to 1.5 GHz Arm Cortex-M0 real-time core GPU – 2D GPU only No VPU, no NPU System Memory – 256MB or 512MB DDR3 Storage 256MB NAND

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8-inch ESP32-P4 touch display offers WiFi 6, BLE, 802.15.4 connectivity, optional 4G LTE and LoRaWAN

Seeed Studio's reTerminal D1001 is an 8-inch capacitive touch display powered by an ESP32-P4 RISC-V microcontroller and equipped with an ESP32-C6 wireless module, a camera, a dual-microphone array, and a speaker. The reTerminal D1001 is a fully enclosed solution designed for HMI applications such as control panels, vision-enabled IoT terminals, video intercoms, and smart dashboards. One highlight compared to other ESP32-P4 displays is optional support for 4G LTE cellular connectivity using an mPCIe module and SIM card slot, as well as LoRaWAN using a Stamp module. reTerminal D1001 specifications: SoC – Espressif Systems ESP32-P4NRW32 CPU Dual-core 32-bit RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz Memory 768 KB HP L2MEM (for dual-core CPU), 32 KB LP SRAM, 8 KB TCM (for LP MCU core) 32MB PSRAM Storage – 128 KB HP ROM, 16

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Nordic Semi nRF93M1 IoT modules offer LTE Cat 1bis cellular connectivity, Wi-Fi location capabilities

Nordic Semiconductors introduced the nRF93M1 LTE Cat 1bis IoT modules at Mobile World Congress 2026 with up to 10 Mbps downlink and 5 Mbps uplink, as well as built-in Wi-Fi location capabilities. Two variants will be offered: the nRF93M1-LABA supporting LTE bands for Europe, Asia, the Middle East, and Africa, and the nRF93M1-LACA supporting a wider range of LTE bands and certifications for worldwide deployments. Nordic Semi nRF93M1 specifications : LTE Cat-1bis modem with 3GPP Rel. 14 support 617-2690 MHz LTE FDD and TDD band support Power Class 3 (23 dBm) Support for (e)UICC/eSIM (SGP.32 IoT) and Software SIM (SoftSIM) framework Data rates - Up to 10 Mbps downlink and 5 Mbps uplink Peripherals - High-speed USB, UART, IOs, coexistence interface, etc... Secure firmware updates via nRF Cloud Location services using Wi-Fi scanning and cellular eCID location Power-saving features - eDRX, PSM, and Nordic proprietary optimizations Certified for global and regional operation (GCF,

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Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules designed to bridge the gap between LTE Cat 4/6 and full-featured 5G. Both the modules support 5G Sub-6GHz SA with LTE Cat 4 fallback, peak data rates of up to 223 Mbps downlink and 123 Mbps uplink, and backward compatibility with Rel-15/16 networks. Additionally, the modules support optional multi-constellation GNSS via Qualcomm IZat Gen 9VT technology along with various interfaces such as USB 2.0 and PCIe 2.0 (plus UART, SPI, I2C, SGMII, PCM on the RG255C-NA). Both support dual SIM, DFOTA, and embedded protocol stacks, and are suitable for industrial IoT, smart grids, video surveillance, mobile hotspots, wearables, and other medium-speed applications. Quectel RM255C-GL and RG255C-NA specifications: Connectivity 5G NR – 3GPP Release 17 RedCap (Reduced Capability) Sub-6 GHz Standalone (SA)

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xSDR – A tiny M.2 2230 SDR module with Artix-7 FPGA and LMS7002M RFIC (Crowdfunding)

https://fed.brid.gy/r/https://www.cnx-software.com/2026/02/16/xsdr-a-tiny-m-2-2230-sdr-with-artix-7-fpga-and-lms7002m-rfic/

xSDR – A tiny M.2 2230 SDR module with Artix-7 FPGA and LMS7002M RFIC (Crowdfunding)

Wavelet Lab's xSDR is a tiny, single-sided M.2 2230 software-defined radio (SDR) module designed for integration into laptops, embedded systems, and edge computing devices. A successor to the company's previous uSDR, the "x" in xSDR stands for "extended," adding 2×2 MIMO support and a wider frequency range to the same tiny footprint. The module is built around the Lime Microsystems LMS7002M RFIC and an AMD Artix-7 XC7A50T FPGA as found in the LimeNET Micro 2.0 Developer Edition board. This combination allows for a tuning range of 30 MHz to 3.8 GHz and a sample rate of up to 122.88 MSPS, making this SDR suitable for cellular research (LTE/5G), spectrum analysis, satellite tracking, and high-speed data links (with two modules). Wavelet Lab's xSDR specifications: RFIC – Lime Microsystems LMS7002M programmable RF (FPRF) transceiver IC FPGA – AMD Embedded XC7A50T (Artix-7) with 52,160 logic cells RF capabilities Channels – 2x2 MIMO (2x

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Avalue EMX-PTLP – A thin mini-ITX motherboard powered by up to an Intel Core Ultra 7 358H Panther Lake-H SoC

https://fed.brid.gy/r/https://www.cnx-software.com/2026/02/13/avalue-emx-ptlp-a-thin-mini-itx-motherboard-powered-by-up-to-intel-core-ultra-7-358h-panther-lake-h-soc/

Avalue EMX-PTLP – A thin mini-ITX motherboard powered by up to an Intel Core Ultra 7 358H Panther Lake-H SoC

Avalue's EMX-PTLP is an industrial, thin mini-ITX motherboard powered by Intel Panther Lake-H Core Ultra (Series 3) family, up to the 12-core Intel Core Ultra 7 358H SoC delivering up to 180 TOPS for AI and industrial automation deployments. The board supports up to 64GB of DDR5 SoDIMM/CSoDIMM memory, features M.2 PCIe 5.0 and PCIe 4.0 sockets for storage and expansion, M.2 E-Key and B-Key sockets for wireless and cellular connectivity, a PCIe x8 slot, HDMI, DisplayPort, USB-C, and LVDS/eDP display interfaces, GbE and 2.5GbE networking interfaces, a range of USB4, USB 3.2, and USB 2.0 interfaces, and more. Avalue EMX-PTLP specifications: SoC - Intel Panther Lake processor with Intel Xe LPG graphics (one or the other) Intel Core Ultra 5 322 6-core (2P + 4LPE) CPU at up to 4.4 GHz with 12MB Smart Cache, 2x Xe core Intel Graphics (18 TOPS), AI accelerator (46 TOPS); PBP: 25 Watts

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PiLink PL-R5/R5M Series – IP20/IP65 Industrial PCs powered by Raspberry Pi CM5

Made by Japan-based PiLink, the PL-R5 and PL-R5M Series are compact industrial PCs powered by a Raspberry Pi Compute Module 5 (CM5) and offered with either IP20 or IP65 ingress protection rating. The PL-R5 Series provides one USB 3.0 port, one Gigabit Ethernet port, and 9V to 40V DC input, while the PL-R5M Series offers one USB 2.0 port, one 100 Mbps Ethernet port, an optional extra Gigabit Ethernet port, and a 10.7V to 28.8V DC input range. Both include optional WiFi 5 and Bluetooth, an M.2 B-Key socket for cellular, optional RS-232, RS-485, I2C interfaces, and more. The IP65 models are offered in Basic, Basic Plus (adds 4x analog inputs, 4x DI/DO), and USB (3x USB ports) configurations. The PL-R5 also adds a DIO CAN IP65 variant with two DI, two DO, and two CAN Bus interfaces. The IP20 variants have an even wider choice of options. PiLink PL-R5/R5M

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Open Stack standalone 4G LTE IoT board runs RTOS on Quectel EC200 LTE module (Crowdfunding)

Open Stack is a standalone 4G LTE IoT connectivity board designed to run RTOS-based C applications directly on the Quectel EC200 series LTE module, meaning you don't need an external MCU like Arduino, ESP32, or Raspberry Pi. By removing the MCU, the board reduces power consumption, bill-of-materials (BOM) cost, and physical footprint. The board supports multi-band LTE with GSM fallback, GNSS, and Bluetooth 4.2, as well as IPv4/IPv6 client and server modes. It also includes a USB Type-C port, a Nano SIM card slot, LTE/GNSS/BLE antenna connectors, an OLED information display, status LEDs, control buttons, and a 40-pin Raspberry Pi HAT-compatible GPIO header. Networking support includes TCP/UDP, SSL/TLS, HTTP/HTTPS, MQTT, LwM2M, CoAP, FTP/FTPS, and PPP, making it suitable for asset tracking, industrial monitoring, BLE-to-LTE gateways, remote infrastructure, and always-connected IoT deployments without additional controller hardware. Open Stack specifications: Cellular Module - Quectel EC200U-CN series (EC200UCNAA-N05-SGNSA) module Cellular Connectivity: LTE FDD

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Geniatech DB3506 is a full-featured Rockchip RK3506 development board and 3.5-inch industrial SBC

Geniatech DB3506 is a full-featured Rockchip RK3506 development board and 3.5-inch SBC designed for industrial control, human–machine interface (HMI) systems, IoT gateways, and other embedded applications. The board combines the tri-core Arm Cortex-A7 SoC with 256 MB to 1 GB LPDDR3 RAM and 256 MB or 512 MB NAND flash options, offers HDMI and RGB touchscreen display interfaces, dual Fast Ethernet, dual-band WiFi and Bluetooth 5.0, optional 4G LTE via a mini PCIe slot,  two USB 2.0 ports, and a range of headers for CAN bus, RS-232/RS-485, Audio, GPIOs, and more. Geniatech DB3506 specifications: SoC – Rockchip RK3506 CPU 3x Arm Cortex-A7 cores Arm Cortex-M0 real-time core GPU – 2D GPU only with hardware-accelerated 2D rendering No VPU, no NPU System Memory – 512MB LPDDR3 (option for 256MB or 1GB) Storage - 256MB NAND flash (option for 512MB) Video Output HDMI output 50-pin RGB display FPC interface up to 1280 × 1280 @ 60

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