Going live at 14:45 Pacific (20 minutes from now) on the next stage of the ReworkCTF.
Challenges 10 and up are mostly all fun inner layer stuff.

Going live at 14:45 Pacific (20 minutes from now) on the next stage of the ReworkCTF.
Challenges 10 and up are mostly all fun inner layer stuff.

Successfully completed challenge 10 (missing via between front and back layers) and 11 (via from front to back shorted to power plane).
Decided not to move on to 12 (solder paste print defect under BGA) because I had just done an aqueous clean around the BGA site and wanted to bake it before doing further rework.
Will be busy tomorrow but I'll bake the board tonight or tomorrow then try to do a lunchtime stream Monday with challenge 12 and on.