DJ🌞Mar 4

This was for the lapping experiment no.2. I am and will be taking images of every step e.g. when I hit a layer. This is around an hour of lapping work and ~18 hours of imaging the result. So one layer per day if I do everything well unlike yesterday, lol.

See alt text for description.

#reverseengineering

Show threadDJ🌞Mar 4
A pad structure including an array of vias to the layer below, visible here as bright dots.
Show threadDJ🌞Mar 4
Sporadically, there are more vias in groups of two. These contact the mesh on top metal.
Show threadDJ🌞Mar 4
Finally, I just like how this looks. A glimpse through three more metal layers.
Show threadDJ🌞Mar 5
Going down further, metal-3 is half gone. Here is what metal-2 and below looks like. Vias are again clearly identifiable.
Show threadRue MohrMar 5
@infosecdj I remember when they first succeeded getting copper on a die. What metal are most of the chips your stripping using?
Show threadDJ🌞
@RueNahcMohr Aluminium interconnect only, as far as I can tell. Copper will be too small to image optically to any avail, I think.
Mar 5 at 8:38pmWeb