Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026

Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026
When Microchip launched the SAM9X60 in 2020, we were surprised to see a new SoC based on a legacy ARM926EJ-S core. But we were even more surprised to see Microchip doubling down with the SAM9X75, a hybrid automotive-qualified (AEC-Q100 Grade 2) System-in-Package (SiP) with the same classic ARM9 core and integrated DDR2 or DDR3L memory. The first part will be the SAM9X75D5M SiP with 512MB on-chip DDR2 RAM, but the company also designed the SAM9X75D1G with 1 Gbit DDR3L and the SAM9X75D2G featuring 2 Gbit DDR3L. The SAM9X75 hybrid ARM9 MCU targets developers who need an MCU-like development environment, while benefiting from higher processing and display capabilities of microprocessors for automotive and e-mobility HMI applications. Microchip SAM9X75D5M specifications: CPU subsystem Core - ARM926EJ-S running up to 800 MHz (significant increase from older 400-600MHz variants) 32 KB data cache, 32 KB instruction cache, and Memory Management Unit (MMU). Memory 512 Mbit







