Panther Lake: Intel sfida la concorrenza con il processo 18A
Panther Lake di Intel è il nuovo processore basato sul processo 18A con RibbonFET e PowerVia; prestazioni AI fino a 180 TOPS, architettura ad alta efficienza.
Intel 18A supererà le prestazioni dei 2nm di TSMC e Samsung?
La corsa ai 2nm si infiamma: Intel 18A con RibbonFET e PowerVia punta a superare TSMC N2 e Samsung SF2. Esaminiamo vantaggi e svantaggi di ciascun processo.
In 2024, Intel Hopes to Leapfrog Its Chipmaking Competitors
The chipmaker is betting on new transistors and power-delivery tech
At IEDM Intel talked about what comes after #PowerVia: Backside Contacted (BSCON) Backside Power.
- necessary for future cell scaling
- Intel is now offering plenty of BSPDN tech the design teams can choose from
German article: https://www.hardwareluxx.de/index.php/news/hardware/prozessoren/62475-iedm-2023-halbleiterforschung-konzentriert-sich-auf-backside-power-delivery.html
IEDM 2023: Halbleiterforschung konzentriert sich auf Backside Power Delivery - Hardwareluxx
IEDM 2023: Halbleiterforschung konzentriert sich auf Backside Power Delivery.
Intel Shows Off New PowerVia Technology; Arriving In 2024
Intel is set to present a couple of papers next week, detailing the progress for two of its transistor technologies:
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