Rockchip RK3538 TV Box SoC and RK3572 mid-range HMI processor are coming soon

While we are eagerly waiting for the RK3668 and RK3688 high-end processors, Rockchip is planning to launch two mid-range SoCs with the RK3538 quad-core Cortex-A55 processor designed for TV boxes, and the RK3572 hexa-core Cortex-A73/A53 SoC for HMI (Human Machine Interface) applications. Rockchip RK3538 TV box SoC Rockchip RK3538 specifications: CPU - Quad-core Arm Cortex-A55 processor with NEON, FPU, ARMv8 Crypto... Cache 32KB L1 instruction cache 32KB L1 data cache and 64KB L2 data cache 512KB unified system L3 cache GPU Arm Mali-G310 3D GPU with support for OpenCL 3.0, OpenGL ES1.1/2.0/3.2, Vulkan 1.2 2D Graphics Engine VPU Decoder H.265, H.264, AV1 (up to two simultaneous 1080p60 channels) VP8, VC1, MPEG-4, MPEG-2, MPEG-1 yp to 1920x1088 @ 60 FPS (1088 is not a typo) H.263 up to 720p60 (M)JPEG up to 8176x8176 @ 76 million pixels per second Encoder - N/A MCU core - RISC-V MCU in PMU domain with

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MediaTek unveils 50 TOPS Genio Pro 5100 Cortex-X925/X4/A720 SoC, 7.2 TOPS Genio 420 Cortex-A78/A55 SoC for AIoT applications

https://fed.brid.gy/r/https://www.cnx-software.com/2026/03/12/mediatek-50-tops-genio-pro-5100-cortex-x925-x4-a720-soc-7-2-tops-genio-420-cortex-a78-a55-soc-for-aiot-applications/

MediaTek unveils 50 TOPS Genio Pro 5100 Cortex-X925/X4/A720 SoC, 7.2 TOPS Genio 420 Cortex-A78/A55 SoC for AIoT applications

After launching the Genio 360/360P hexa/octa-core SoCs last month, MediaTek has now expanded the lineup with the Genio Pro 5100 and Genio 420 AIoT SoCs at Embedded World 2026. The Genio Pro 5100 is a 3nm SoC with an "all big-core" architecture and a 50+ TOPS NPU for Edge AI applications. The Genio 420, on the other hand, is a cost-efficient 6nm platform designed for smart home, retail, and industrial IoT devices. MediaTek Genio Pro 5100 The Genio Pro 5100 integrates one Cortex-X925, three Cortex-X4, and four Cortex-A720 cores, as well as an Arm Immortalis-G925 GPU, and supports LPDDR5X memory up to 8533 Mbps. It can handle up to three 4K displays, up to 16 cameras via virtual channels, and 8K30 video encode/decode, and offers interfaces such as PCIe Gen4, USB 3.2 Gen2, USB 2.0, and dual 2.5GbE MAC. Genio Pro 5100 (MT8894) specifications:  CPU - 8-core Arm v9.2 processor

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NXP i.MX 937 cost-effective Cortex-A55/M7/M33 MPU is a drop-in replacement for NXP i.MX 95 SoC family

The 1 .4 GHz NXP i.MX 937 quad-core Cortex-A55 microprocessor (MPU) for HMI and Edge AI applications aims to fill the gap between entry-level NXP i.MX 93 SoCs and higher-end parts like the NXP i.MX 952 processor family, while offering pin-to-pin compatibility with the latter. The i.MX 937 MPU also features a dedicated 667 MHz Arm Cortex -M7 for real-time workloads and a low-power Arm Cortex-M33 core for system management tasks, supports LPDDR4x or LPDDR5 memory, integrates an Arm Mali G310 3D GPU, a VPU for 1080p H.26x video encoding and decoding, and a 2 eTOPS NXP eIQ Neutron NPU for machine learning (ML) acceleration. Since it targets HMI applications, we'll also find MIPI DSI and LVDS display interfaces, and a 4-lane MIPI CSI camera interface, plus various other I/Os. NXP i.MX 937 specifications: (highlights in bold compared to other i.MX 93 parts) CPU Up to 4x Arm Cortex-A55 cores

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NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

https://fed.brid.gy/r/https://www.cnx-software.com/2026/03/10/nxp-i-mx-93w-wireless-mpu-sip-pairs-dual-core-arm-cortex-a55-processor-with-nxp-iw610-wifi-6-bluetooth-le-and-805-15-4-radio/

NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

NXP i.MX 93W is the company's first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU - 2D graphics accelerator AI accelerator - Arm Ethos-U65 microNPU Memory I/F - Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F - 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface - 2-lane MIPI CSI up

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