Researchers from Heidelberg University and University of Münster have demonstrated a 3D printed plug-and-play fiber interface for photonic integrated circuits, achieving just 0.78 dB total coupling loss. The breakthrough enables low-loss fiber coupling for chips using additive manufacturing. https://3dprintingindustry.com/news/3d-printed-plug-and-play-packaging-enables-low-loss-fiber-coupling-for-photonic-chips-249763/ #3Dprint #3Dprinting #Materials #Photonics

3D Printed plug-and-play Packaging Enables low-loss Fiber Coupling for Photonic Chips - 3D Printing Industry
Researchers led by Erik Jung from Heidelberg University, a German research university with programs in photonics and nanotechnology, together with collaborators including Wolfram Pernice from University of Münster, a public research university known for work in nanophotonics and materials science, have demonstrated a plug-and-play fiber interface for photonic integrated circuits (PICs) that achieves 0.78-decibel total […]