ST VL53L9CX direct Time-of-Flight 3D LiDAR supports 5cm to 9m range, 2.3K zones resolution
STMicroelectronics VL53L9CX, or VL53L9 for short, is the company's first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module. It offers a sensing range of 5 centimeters to 9 meters, a wide 72º field of view, a resolution of 2.3K zones, and up to 100 Hz frame rate. ST's ToF sensors have gone a long way since we covered the VL53L0X sensor with a single zone and 2-meter range in 2017. Since then, the company has steadily improved its tiny ToF sensors with up to 64 zones and long range in recent sensors like the VL53L8CP. While the VL53L9CX is still tiny at 12.8 x 6.1 x 4.6 mm, it's in a class of its own, acting like a mini 3D scanner with 2268 zones, and will be used for a range of applications in robotics, industrial automation, smart buildings, AR/VR, and healthcare. ST VL53L9CX 3D ToF camera module specifications: Multizone ranging
Qualcomm promises a major reset with upstream-first, Qualcomm Linux 2.0 for Dragonwing IoT platforms
Linux on Qualcomm SoCs has been a roller coaster, with hope often followed by disappointment, at least for the Snapdragon family. The company aims to change that with Qualcomm Linux 2.0 for Dragonwing IoT platforms, as announced on LinkedIn: With Qualcomm Linux 2.0, we’re shifting to an upstream-first, open development model that is unified and scalable across all Qualcomm Dragonwing IoT platforms. This means an upstream‑first model with a BSP that tracks mainline to minimize friction and enables you to make more predictable builds. Tune in to see our first-ever live demo, along with a lifecycle and release strategy, core architecture and Yocto changes, and practical migration paths from previous versions The video is embedded below, but will only be live on June 30. In the meantime, the description provides a few more details: If you’ve dealt with fragmented BSPs, platform-specific kernel forks, or painful bring‑up across Qualcomm SoCs, this
Zhihe A210 octa-core RISC-V SoC with 12 TOPS NPU powers SoM-based development board
Last year, we noted three upcoming high-performance RISC-V SoCs to watch out for: Zhihe A210, SpacemiT K3, and UltraRISC UR-DP1000. The K3 has already been launched, and I'll work on the K3-Pico-ITX SBC/mini PC review this coming weekend, while the UR-DP1000 is (still?) expected on the Milk-V Titan motherboard. However, we did not have that many details about the Zhihe A210 so far. This has now changed since documentation has surfaced for the Zhihe A210 and a development kit (A210 SODIMM V2) based on a carrier board and a system-on-module itself powered by the octa-core RISC-V processor. Let's have a look at both. Zhihe A210 octa-core RISC-V SoC Zhihe A210 specifications: CPU - Octa-core RISC-V RV64GCV processor 4x 64-bit RISC-V C920 cores @ up to 2.3 GHz with 64 KB I Cache and 64 KB D Cache for each core, 1 MB L2 cache; note: 1.9 GHz is also shown
M5Stack Capsule Kit v1.1- A Battery-powered ESP32-S3 IoT controller with IMU sensor, MEMS microphone, and IR transmitter
M5Stack Capsule v1.1 is a Stamp-S3A-based IoT controller with a microSD card slot, several sensors (6-axis IMU, microphone), an IR transmitter, a built-in 250 mAh battery, a few buttons, a buzzer, an RTC, and expansion capabilities through GPIO headers and a Grove connector. It's an upgrade to the earlier Capsule based on the Stamp-S3 module. The new version still features an ESP32-S3 WiFi and Bluetooth microcontroller, 8MB flash, a USB-C port, and a few GPIOs, but benefits from the Stamp-S3A improvements, including an optimized antenna design and lower power consumption. We never had a look at the Capsule before, so let's do it now. M5Stack Capsule v1.1 specifications: M5Stack Stamp-S3A module WiSoC – Espressif Systems ESP32-S3FN8 CPU Dual-core 32-bit Xtensa LX7 microcontroller with AI vector instructions up to 240MHz RISC-V ULP co-processor Memory – 512KB SRAM Storage – 8MB flash Wireless – 2.4GHz WiFi 4 (802.11b/g/n), Bluetooth 5.0 LE +
Fortior FU75xx dual-core motor control MCU family combines 32-bit RISC-V core with 2nd-gen Motor Engine (ME2) core
Motor driver IC specialist Fortior Technology has recently introduced the FU75xx dual-core motor control MCU family, pairing a 32-bit RISC-V core and the company’s proprietary 2nd-generation Motor Engine (ME2) core. The RISC-V core is used for parameter configuration and routine processing, while the ME core integrates FOC and CORDIC modules that enable fast calculation of FOC (as quick as 5µs) or square-wave control for sensored/sensorless BLDC/PMSM motors. The chips have an impressive list of peripherals (see specs below) and target high-speed computing and real-time control for robotics and motion systems, such as industrial servo drives, robotic joints, smart home appliances, and new energy vehicle systems. FU75xx MCU specifications: Dual-core CPU RISC-V core @ 48 MHz ME2 motor engine core @ 48 MHz with FOC module and CORDIC module Memory - 12kB SRAM, 4kB PRAM for program execution Storage - 64kB Flash with ECC and CRC, self-program and code protection I/Os
PZSDR P047 RF-ADC and RF-DAC high-end SDR board is based on AMD Zynq UltraScale+ ZU47DR RFSoC (Crowdfunding)
PZSDR P047 RF-ADC and RF-DAC software-defined radio (SDR) board is based on AMD Zynq UltraScale+ ZU47DR RFSoC with a quad-core Cortex-A53 processor, a dual-core Cortex-R5F real-time CPU, FPGA fabric, eight RF ADCs, and eight RF DACs. The board features 6GB of DDR4 memory (4GB for PS, 2GB for PL), 8 GB eMMC flash, and 512 Mbit QSPI flash, plus microSD card and M.2 NVMe sockets for storage, a mini DP video output, a Gigabit Ethernet RJ45 port, two 100 Gbps QSFP28 cages, a USB 3.0 port, plus JTAG and serial debug interfaces, and a 32-pin IO header. It makes use of all RF channels of the RFSoC with 8 receiver and 8 transmitter connectors, plus various clock inputs. The company says the PZSDR P047 is ideal for advanced MIMO wireless applications such as cellular and shortwave communication. PZSDR P047 RF-ADC and RF-DAC specifications: SoC FPGA - AMD Xilinx Zynq UltraScale+
Convert old IR remote controls into presentation clickers using an RP2040 USB board and open-source TTVKTR firmware
Brisk4t's "Tossed The TV — Kept The Remote" (TTVKTR) is an open-source firmware project for Raspberry Pi RP2040 USB boards that aims to reduce electronics waste by converting old IR remote controls into presentation clickers. Most Raspberry Pi RP2040 boards with USB ports should work, but the project highlights the Waveshare RP2040-Zero combined with a standard 38 kHz infrared receiver due to its small size and low price ($4-5). The project also relies on the built-in RGB LED for layer color feedback. That's about it for the hardware. It just required some basic soldering of the IR receiver to GPIO 28 (OUT), 5V or 3.3V, and GND pins. Nothing too hard. The WS2812 RGB LED is already connected to GPIO 16. I tried to look for RP2040 USB boards with a built-in IR receiver, but I could not find any. The firmware receives IR codes from a standard 38
Forlinx launches Rockchip RK3572 system-on-module (SoM) and development board with Linux 6.12 BSP
We noticed the Rockchip RK3572 mid-range HMI SoC a couple of months ago, and Forlinx has launched the first system-on-module (FET3572-C SoM) based on the processor, along with a development board (OK3572-C) and BSP (Board Support Package) with a fairly recent Linux 6.12 kernel. The octa-core Cortex-A73/A53 processor features a 4 TOPS NPU (the same as in the RK3588) and targets HMI applications leveraging Edge AI for consumer electronics, industrial control, edge computing, smart security, and in-vehicle terminals. Forlinx FET3572-C Rockchip RK3572 system-on-module Specifications: SoC - Rockchip RK3572 or RK3572J Octa-core CPU - 2x Arm Cortex-A73 @ up to 2.2 GHz+ 2x Arm Cortex-A53 @ up to 2.1 GHz + 4x Arm Cortex-A53 @ up to 2.1 GHz GPU - Arm Mali-G310V2 MC1 with support for OpenGL ES 1.1/2.0/3.2, OpenCL 3.0, and Vulkan 1.4 VPU Hardware Encoding -H.264, H265, 4K @ 60fps Hardware Decoding - H.264, H.265, VP9, AV1, AVS2,
Nuvoton NuMaker-GestureAI-M55M1 module combines Cortex-M55 MCU with GC0308 camera for AI gesture control
Back in November last year, we covered the launch of the NuMicro M55M1 MCU from Nuvoton, which combines an Arm Cortex-M55 core with an Ethos-U55 microNPU for on-device AI and gesture control. Now, they have released the NuMaker-GestureAI-M55M1, a development module based on that MCU for AI vision-related applications. This new board integrates the M55M1 MCU with a GC0308 CMOS image sensor, a digital microphone, and a microSD card slot for storing AI models. It is designed for applications such as gesture control, basic vision systems, and touchless interfaces. NuMaker-GestureAI-M55M1 specifications: MCU – Nuvoton NuMicro M55M1R2LJAE CPU - Cortex-M55 MCU @ 220 MHz Memory - 1.5 MB SRAM Storage - 2 MB Flash AI Accelerator - Arm Ethos-U55 micro-NPU @ 220 MHz Storage – MicroSD card slot (located on the back) for storing AI model files Camera – Integrated VGA GC0308 CMOS image sensor Audio – On-board digital microphone (DMIC) USB –
Radxa’s 2026 Qualcomm hardware: Dragon Q8B and Q5E SBCs, DragonStation and DragonBay NAS systems
Radxa started its partnership with Qualcomm last with the Dragon Q6A SBC, but it turns out it was just the start, and the company showcased more Qualcomm SBCs and NAS systems at a Radxa + Qualcomm developer day on May 30, 2026. The Radxa Q8B SBC will be based on a Qualcomm Snapdragon 8cx Gen3 octa-core SoC, the Q5E SBC on a Dragonwing QCS6690 octa-core Kryo SoC, and the company also teased DragonStation and DragonBay NAS systems, and a 2026 roadmap features a total of 22 Qualcomm systems made by Radxa. Radxa Dragon Q8B Dragon Q8B specifications: SoC – Qualcomm Snapdragon 8cx Gen 3 compute platform Octa-core CPU – 4x 3.0 GHz Kryo Prime cores, 4x 2.4 GHz Kryo Efficiency Cores GPU – Adreno 690 GPU with DirectX 12 (DX12) API support DSP – Qualcomm Hexagon Processor, Qualcomm Sensing Hub AI – Qualcomm Neural Processing Engine SDK support for AI
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